We successfully delivered a precision machined green FR4 precision hole plate for a semiconductor equipment manufacturer. Machined from green FR4 fiberglass epoxy laminate, this component features four precision-drilled small holes in a linear array for critical alignment applications in semiconductor processing equipment. The milled plate maintains exceptional dimensional stability and electrical insulation properties required for cleanroom environments.
| Project Name | Green FR4 Semiconductor Precision Hole Plate |
| Material | FR4 Fiberglass Epoxy Laminate |
| Material Color | Green |
| Process | CNC milling + Precision Drilling |
| Key Feature | Linear array of 4 precision micro-holes |
| Hole Diameter | As specified (precision drilled) |
| Hole Position Tolerance | ±0.01mm between holes |
| Hole Perpendicularity | ≤ 0.02mm |
| Dimensional Tolerance | ±0.02mm on plate contour |
| Surface Finish | Ra ≤ 1.6μm |
| Flatness | ≤ 0.05mm over entire plate |
| Dielectric Strength | > 20 kV/mm |
| Application | Semiconductor equipment / Precision alignment fixtures |
| Property | Value |
| Continuous Operating Temperature | 130°C (Class B) |
| Dielectric Strength | > 20 kV/mm |
| Flammability Rating | UL94 V-0 |
| Water Absorption | < 0.1% (24 hours) |
| Tensile Strength | > 300 MPa |
| Flexural Strength | > 400 MPa |
100% inspection performed using high-resolution vision measurement system and ZEISS CMM with 1.5μm repeatability. All four hole positions verified for linear accuracy and spacing. Hole diameter and perpendicularity checked on each part. Flatness verified on granite inspection table. Material certification and first-article inspection report provided with each batch.
✓ Semiconductor manufacturing equipment
✓ Wafer handling fixtures
✓ Precision alignment tools
✓ PCB testing and probing fixtures
✓ Cleanroom assembly stations
✓ Electronic component positioning
✓ Photolithography equipment components
